Cloud native EDA tools & pre-optimized hardware platforms
This newsletter provides the latest information on Synopsys Photonic 91³Ô¹ÏÍø including product announcements, new papers, tech talks, upcoming events, and more.
Synopsys Photonic 91³Ô¹ÏÍø would like to wish you happy holidays and thank you for being loyal customers. Let us know how we can help and support you during this time.
From December 25, 2023 to January 1, 2024, Photonic 91³Ô¹ÏÍø technical support will be unavailable. We will respond to product support and general inquiries for all products starting on January 2, 2024.
Thank you for your patience and understanding.
New features and enhancements include:
This release includes several usability updates and speed improvements. BSDF file generation with DiffractMOD RCWA is now faster, and MetaOptic Designer has significant speed enhancements. Parameter scans, including BSDF file generation, has improved stability, and the TCAD material files can now be directly used in RSoft simulations. MetaOptic Designer can now edit material files directly, output MTF and far-field, use MTF as an optimization target, and has improved memory handling and performance when generating GDS files.
See the * for a complete list of changes/updates.
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Semiconductor Engineering
Fig. 1: OptSim simulation setup for measuring modulator chirp factor and fiber dispersion
Modulator¡¯s chirp factor and chromatic dispersion of the fiber are two of the parameters responsible for setting an upper limit of the fiber-optic system performance. Interplay between fiber nonlinearities and dispersion also impact the system performance. Both ¨C modulator chirp factor and fiber dispersion - are input parameters for the modulator and nonlinear fiber models in OptSim. These parameters are typically supplied by the manufacturers and easily available from the datasheets.
However, there are times when a user may want to measure chirp factor and fiber dispersion in response to design changes or operating conditions, such as temperature, reverse bias or mismatch in modulator arm-lengths. In this application note, we demonstrate a measurement method that is applicable for measuring for both the chirp factor and the dispersion.
Fig. 2: OptSim simulation setup for estimating noise figure of the RF-over-Fiber link
The design trade-offs in RoF systems involve noise, sensitivity, bandwidth, dynamic range and linearity of the link. From the perspective of the transmit side, link linearity and high RF output power over wide bandwidth are more important than noise. On the other hand, from the perspective of the receiving end, low noise and high dynamic range are of utmost importance. The RF noise figure of the RoF link is usually defined with respect to the weak input signals, mostly out of concern for dynamic range rather than sensitivity. In this application note, we demonstrate how to estimate noise figure for an RoF link.
The design trade-offs in RoF systems involve noise, sensitivity, bandwidth, dynamic range and linearity of the link. From the perspective of the transmit side, link linearity and high RF output power over wide bandwidth are more important than noise. On the other hand, from the perspective of the receiving end, low noise and high dynamic range are of utmost importance. The RF noise figure of the RoF link is usually defined with respect to the weak input signals, mostly out of concern for dynamic range rather than sensitivity. In this application note, we demonstrate how to estimate noise figure for an RoF link.
As a foundry for photonic integrated circuits (photonic ICs), SMART Photonics fuels numerous applications in telecommunications, data, sensing, and healthcare. By harnessing light, photonic ICs promote energy efficiency and precision while addressing global challenges such as energy conservation, healthcare improvements, food waste, and growing data demands.
SMART Photonics offers a comprehensive Process Design Kit (PDK), with 50+ proprietary building blocks, that provides customers with an easy entry into the promising world of InP photonic ICs. The combination of the SMART Photonics PDK with the Synopsys OptoCompiler platform places the design of these transformative chips within reach.
The SMART Photonics high-speed PIC technology platform offers PDKs for both C and O bands that support high-speed coherent solutions, Passive Optical Networks (PONs), and Quantum Key Distribution (QKD). High-speed photonic chips, in demand owing to the surge in AI architectures for data centers, underscore the need for ecosystem engageability. SMART Photonics and Synopsys are ready to respond to this wave. Want to learn more, or access the SMART Photonics PDK for the Synopsys solution? Check out their website: , or read more about SMART Photonics in this or watch the .
Wednesday, January 10, 2024
10:00¨C11:00 a.m. EST (North America)
4:00¨C5:00 p.m. CET (Europe)
Online via Zoom
Meet our experts and check out product demos at Booth 543
January 30¨CFebruary 1, 2024
The Moscone Center
San Francisco, CA
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Our friendly booth staff at the ECOC Conference in Glasglow, Scotland in October
Questions? We're happy to answer your technical questions about Synopsys Photonic Device Compiler, RSoft Photonic Device Tools, Synopsys OptSim, Synopsys OptoCompiler, and Synopsys OptoDesigner. Email us at photonics_support@synopsys.com.
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