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Intel Presents: Modern EDA 91³Ô¹ÏÍø for Scalable Heterogeneous Systems
Date: Jun 05, 2025 | 10:00 AM PDT
Featured Speakers:
- Vivek Rajan, Sr. Principal Engineer, Intel
- Amlendu Choubey, Sr. Director, Product Management, Synopsys
Why You Should Attend:
Rapidly emerging new workloads and disruptive architectures have highlighted the importance of advanced packaging and 3DIC technologies. The scaling of Moore¡¯s Law has pushed the boundaries of Electronic Design Automation (EDA) over the last 40 years. The next decades will drive System Technology Co-optimization (STCO), where EDA will evolve to manage multiphysics-based early analysis, construction, and co-optimization across silicon, package, board and systems.
Attend this Synopsys and Intel webinar to learn about
- Practical use cases for heterogeneous system design and convergence, including design workflows to architect, build, and converge from concept to signoff.
- The benefits of such workflows, which includes 2X better effort and runtime for early analysis of new product architectures, native automation for large scale bump planning and optimization, in-design assembly rules, and what-if analysis scenarios.
- Intel¡¯s future vision and roadmap for continued innovation and integration with Synopsys.
Register Now
Featured Speakers
Vivek Rajan
Sr. Principal Engineer, Intel
Vivek Rajan is a senior principal engineer at Intel with over 25 years of experience in digital design methodology, chip integration, technology, and 3DIC system co-optimization. Vivek received his bachelor's degree in electrical engineering from IIT Kharagpur, India and his master¡¯s degree in electrical systems engineering from University of Connecticut. Vivek actively raises awareness and drives innovation for emerging shifts in chip Integration and systems design. As an invited speaker, Vivek has delivered several technical presentations at industry conferences.
Amlendu Choubley
Sr. Director, Product Management, Synopsys
Amlendu Shekhar Choubey is the Sr. Director of product management for the 3DIC Compiler platform. He has over 20 years of experience in EDA, semiconductor IP, and advanced packaging, with a strong background in product management, product strategy, and strategic partnerships.
Amlendu has expertise in package-board software, including AI-driven design solutions, cloud-based services, and driving growth in emerging markets.
Amlendu holds an MBA from UC Berkeley¡¯s Haas School of Business and a B. Tech in Electrical Engineering from IIT Kanpur.