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AMD Presents: 3D Odyssey - Navigating the Depths of 3DIC Feasibility Analysis
Date: May 21, 2025 | 10:00 AM PDT
Featured Speakers:
- Nitin Navale, Principal Member of Technical Staff, AMD
- Amlendu Choubey, Sr. Director, Product Management, Synopsys
Why You Should Attend:
With the rising demand for highly efficient 3DIC design and performance, it¡¯s crucial to understand the IR and thermal landscape of a product as early as possible in the design process. Voltage drop (IR) increases gradually across many metal layers on multiple stacked dies, potentially adding up to serious performance degradation for upper tiers. Meanwhile, even a small pocket of uncontrolled heating can spread over a single die or even cross to neighboring dies. Both effects can result in catastrophic device and interconnect failure, and both will be more difficult to control as 3DIC products grow larger and more complex.
This AMD presentation, which won the Best Technical Paper Award at SNUG Silicon Valley 2025, focuses on 3Dblox v2.0 and its promise to empower 3D Floorplanning with actionable IR and thermal data. AMD¡¯s experiments are driven primarily within the Synopsys 3DIC Compiler platform, though other tools are employed at key stages to support and reinforce their analysis.
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Featured Speakers
Nitin Navale
Principal Member of Technical Staff, AMD
Nitin Navale has worked at AMD & Xilinx since 2008 and currently serves as Technical Lead for 3DIC Methodology. He has previously contributed to CAD automation across a wide range of disciplines including STA, EMIR, ESD, SoC floorplanning & construction, IP management, netlisting, and characterization. Nitin earned his BS and MS in Electrical Engineering from the University of Illinois, Urbana-Champaign. Outside of work, he is consumed by his devotion to gaming, strategy, and music.
Amlendu Shekhar Choubey
Sr. Director, Product Management, Synopsys
Amlendu Shekhar Choubey is the Sr. Director of product management for the 3DIC Compiler platform. He has over 20 years of experience in EDA, semiconductor IP, and advanced packaging, with a strong background in product management, product strategy, and strategic partnerships.
Amlendu has expertise in package-board software, including AI-driven design solutions, cloud-based services, and driving growth in emerging markets.
Amlendu holds an MBA from UC Berkeley¡¯s Haas School of Business and a B. Tech in Electrical Engineering from IIT Kanpur.