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Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, enables seamless migration to 2.5D and 3D heterogeneous integration. The 3DIC Compiler platform, successfully adopted by customers, is certified by leading foundries for advanced process and packaging technologies.

In a single environment, the platform allows:

• Analysis-driven feasibility exploration, multi-die partitioning, and foundry technology selection for prototyping and floorplanning
• Analysis-driven design implementation, including advanced packaging and die-to-die routing, with golden signoff verification

Download the brochure to find out how to make your die/package co-design more seamless.