Synopsys Gen 2 DDR multiPHY IP cores are mixed-signal PHY IP cores that supply the complete physical interface to JEDEC standard LPDDR2, LPDDR3, and DDR3 SDRAM memories. The Gen 2 DDR multiPHY IP supports the entire range of DDR3 SDRAM speeds, from DDR3-666 through DDR3-2133, LPDDR2 SDRAMs from 0 to 1066 Mbps and LPDDR3 SDRAMs from 0 to 2133 Mbps. The Gen 2 DDR multiPHY IP are compiled into a hard macro that is optimized for specific foundry nodes. Each Gen 2 DDR multiPHY is constructed from the following libraries of components: application-specific SSTL I/O library, a single address/command macro block, multiple byte wide data macro blocks instantiated as many times as required to accommodate the memory channel width and separate PLL macrocells that directly abut to the address/command macro block and data macro blocks.

A key component of the Synopsys Gen 2 DDR multiPHY is the extensive in-system data training/calibration capability that is used to maximize the overall timing budget and improve system reliability. The Synopsys Gen 2 DDR multiPHY contains calibration circuits for read data eye training (optimizes and maintains the optimal DQS offset into the center of the read data eye), write data eye training (optimizes and maintains the optimal DQS offset into the center of the write data eye), per-bit deskew training (minimizes bit to bit timing skew for reads and writes independently), DDR3 write leveling, and DDR3 read leveling. The Gen 2 DDR multiPHY also supports per-bit deskew calibration of the address/command bus for LPDDR3 SDRAMs.

Highlights

Support for JEDEC standard LPDDR2, LPDDR3, and DDR3 SDRAMs

Includes support for DDR3L (1.35V) and DDR3U (1.25V) SDRAMs

When combined with a Synopsys DDR memory or protocol controller and verification IP, Synopsys provides a complete DDR3/LPDDR2/LPDDR3 interface IP solution
Compatible with the Synopsys DDR PHY Compiler

GUI-based tool used to assemble a customized DDR PHY targeting a specific application

Scalable architecture that supports data rates up to DDR3-2133
Support for DIMMs
Delivery of product as a hardened mixed-signal macrocell components allows precise control of timing critical delay and skew paths
Low latency
PHY Utility Bock (PUBM2) included as a soft IP utility that includes control features, such as write leveling and data eye training, and provides support for production testing of the Gen 2 DDR multiPHY
DFI 2.1 compliant interface
Configurable external data bus widths between 8 and 64 bits in 8-bit increments, plus ECC
Permits operation with SDRAMs using data widths narrower than the compiled data width (for example, a 32-bit interface can use just 16 bits to interface to a 16-bit wide SDRAM)
Support for 1 to 4 memory ranks
PHY-Controller interface runs in 1:1 or 1:2 mode (ratio of application bus clock to SDRAM clock), simplifying core logic timing constraints
Includes the PLL and all timing circuits necessary to meet timing specifications
Write leveling timing circuits to compensate address and control versus data delays
Write and read bit timing circuits compensate per-bit delay skew of individual data bits within each data byte
Per-bit deskew of the address/command bus for LPDDR3 SDRAMs
Locally calibrated timing circuits minimize OCV and ACLV effects, and accommodate voltage or temperature change induced timing drift
Area-optimized I/O

6 layers of metal
25um I/O pitch for 28nm
Supports circuit under pad (CUP) and bond over active (BOA)
Supports flip chip and wire bond

I/O retention mode

Maintains I/O drive state during VDD power down
Optional CKE retention mode permits VDD and all non-essential I/Os to be powered down while retaining the external SDRAMs in self refresh mode

Accommodates any poly orientation in 28nm processes and below, allowing the Gen 2 DDR multiPHY to go around a corner if required
Advanced testability

At-speed loopback testing on both the address and data channels
Delay line oscillator test mode
MUX-scan ATPG

Optional DDR signal integrity service is available to assist customers with the integration of the PHY into their SoC, package, and printed circuit board environments