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Synopsys XSR PHY IP

The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency, low-power, and compact PHY supports NRZ and PAM-4 signaling from 2.5G to 112G data rates and is compliant with the OIF CEI-112G and CEI-56G standards for extra-short reach (XSR) links. The XSR PHY offers a flexible layout for maximum bandwidth per die edge by allowing the placement of the square macros along all edges of the die. It deploys 16-lane transmit and receive macros for optimized segmentation on the multiple dies. The robust DLL-based clock-forwarded architecture enables high energy efficiency while supporting reliable links of up to 50 millimeters for large MCMs. The PHY enables multi-die connectivity over organic substrates, which helps reduce packaging costs without requiring advanced interposer-based packaging over shorter distances. The embedded bit error rate (BER) tester and nondestructive 2D eye monitor capability provide on-chip testability and visibility into channel performance. Besides the PMA and PMD, the PHY includes a raw PCS to facilitate the interface with the on-chip network, regardless of the existing networking protocol. The XSR IP is combined with Synopsys¡¯ comprehensive routing feasibility analysis, package substrate guidelines, signal and power integrity models, and crosstalk analysis for fast and reliable integration into SoCs.

Additional resources:
Glossary page: What is a Die-to-Die Interface?
Blog:

Synopsys XSR PHY IP

 

Highlights
Products
Downloads and Documentation
  • 16-lane TX and RX square macros for placement in any edge of the die
  • Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
  • Implements NRZ and PAM-4 signaling
  • Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
  • Robust DLL-based, clock-forwarded architecture minimizes complexity and power dissipation
  • Linear equalization and T-Coils in RX and TX allow compliance to XSR links up to 50mm for large MCM designs
  • Low jitter phase-locked loops (PLLs) provide robust timing recovery and better jitter performance
  • Compliant with the OIF CEI-112G and CEI-56G standards for XSR links
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to GF 12LP+ x8, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X16, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X8, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientationSTARs Subscribe
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to GF 12LP+ x8, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_gf12lpp_x8ns
Version: 1.00a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_gf12lpp_x8ns
Product Code: F925-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc12ffc_x16ns
Version: 2.03a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc12ffc_x16ns
Product Code: G561-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc12ffc_x8ns
Version: 2.02a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc12ffc_x8ns
Product Code: F330-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc5ff_x16ns
Version: 2.02a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc5ff_x16ns
Product Code: E474-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X8, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc5ff_x8ns
Version: 2.01a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc5ff_x8ns
Product Code: F338-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc6ff_x16ns
Version: 2.00a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc6ff_x16ns
Product Code: F335-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc7ff_x16ns
Version: 2.01a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc7ff_x16ns
Product Code: E829-0